Prodotti
Ultrasonic Target Plane Indium Coating Machine High Frequency 20Khz
Item No: FSY-2010-PL
Frequency: 20khz
Power: 1000w
Temperature Range: 150-400℃
Working Amplitude: 3-20μm
Input Voltage: 220V±10%,50/60Hz, 4A
Hangzhou Shengtu Technology Co., Ltd. is one of the leading manufacturers and suppliers of ultrasonic target plane indium coating machine high frequency 20khz in China. Welcome to buy high quality customized products at low price from our factory. Contact us for more details.
The high-frequency 20Khz ultrasonic target material flat coating machine is specialized for automatic uniform coating of indium on flat copper backplates, ceramic flat targets, ITO flat targets, silicon substrates, and ceramic heat dissipation substrates on one or both sides. It is the core mass production equipment for sputtering target material binding process, relying on ultrasonic vibration to achieve flux free molten indium uniform coating.
1. Digital intelligent ultrasound generator: 20kHz (other frequencies can be customized according to requirements), adjustable power of 1000-2500W, automatic frequency tracking, overload protection;
2. Piezoelectric transducer+titanium alloy amplitude rod, with amplitude adjustable in a closed-loop range of 5-18 μ m;
3. Special hard alloy welding head for flat surfaces: rectangular flat cutting head, wear-resistant, non stick to indium, can be customized in length according to the width of the workpiece.
1. Uniform thickness and height
The tolerance of the entire indium layer on the board is ± 0.005mm, with a controllable thickness range of 0.01-0.06mm. There are no thick or thin edges, no missed coatings, and no bubbles or pores, greatly reducing poor bonding and delamination of the target material.
2. Significant savings in indium precious metals
Compared to manual scraping of indium, indium loss is reduced by 30% to 45%, and the cost saving effect of large-area flat workpieces is significant.
3. Flux free clean process
No chemical flux residue, no need for subsequent acid-base cleaning, suitable for high cleanliness display and semiconductor target production.
4. Suitable for planar bonding of dissimilar materials
Ceramics ITO, Molybdenum, silicon, and copper backplates have significant differences in thermal expansion, and a uniform thin indium layer buffers thermal stress, ensuring no cracking or off target at high sputtering temperatures.
5. Consistent and stable mass production
Program solidification process eliminates manual operation differences, achieves 24-hour continuous stable mass production, and significantly improves yield.





























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